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ABOUT US
ABOUT ZHONGSHINominated Supplier of China Aerospace and Defence companies
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PRODUCTS
PRODUCTSAll Real Products guide
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APPLICATION
APPLICATIONProvide Customized Solutions and services
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RESEARCH
SCIENTIFIC RESEARCHScience & Technology Progress rapidly,And New products are constantly changing
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SERVICE
SERVICE SUPPORTDeep Cultivation of High-end solder industry head enterprise for more than 20 years
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CONTACT US
CONTACT USTo Provide You with professional consulting services
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EN
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PRODUCTS
Oxygen-free copper
Solder Preforms
Solder Paste
Solder Wire
Solder Bar
BGA Ball
Flux/Thinner/Cleaner
High Precision Copper Profiles
Solder Preforms
SOLDER PREFORMS
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Paste
SOLDER PASTE
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Wire
SOLDER WIRE
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Bar
SOLDER BAR
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
BGA Ball
BGA BALL
This product is suitable for BGA, CSP, MCM and other IC packaging, but also used in other micro-welding.
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Flux/Thinner/Cleaner
FLUX/THINNER/CLEANER
We also supply our customers with flux, thinner, cleaning agent, red glue and other products.
LEARN MORE >
High Precision Copper Profiles
HIGH PRECISION COPPER PROFILES
We produce high precision copper profiles with excellent electrical and thermal conductivity, which are used as the reliable and stable components in extreme environments.
Applications: Power,Electronics, Superconductor,Nuclear fusion, Medical equipment etc.
LEARN MORE >
Solder Preforms
SOLDER PREFORMS
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Paste
SOLDER PASTE
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Wire
SOLDER WIRE
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
Solder Bar
SOLDER BAR
Zhongshi solder paste is prepared with low oxygen content real round rice solder powder made by ultrasonic atomization process and self-developed and improved solder paste. The whole production is completed in vacuum or nitrogen environment. Suitable for SMT process, radiator welding process, semiconductor chip and automotive electronics welding process.
LEARN MORE >
BGA Ball
BGA BALL
This product is suitable for BGA, CSP, MCM and other IC packaging, but also used in other micro-welding.
LEARN MORE >
Flux/Thinner/Cleaner
FLUX/THINNER/CLEANER
We also supply our customers with flux, thinner, cleaning agent, red glue and other products.
LEARN MORE >
High Precision Copper Profiles
HIGH PRECISION COPPER PROFILES
We produce high precision copper profiles with excellent electrical and thermal conductivity, which are used as the reliable and stable components in extreme environments.
Applications: Power,Electronics, Superconductor,Nuclear fusion, Medical equipment etc.
LEARN MORE >
ZHONGSHI WILL UPHOLD INNOVATION
BE THE LEADER OF CHINA
BE THE LEADER OF CHINA
ABOUT ZHONGSHI
Guangdong Zhongshi Metal Co., Ltd. is a manufacturer of high quality welding materials for aerospace, military and civil use. Founded in 1999, the company is headquartered in Songshan Lake, Dongguan City, Guangdong Province. The registered capital is 22 million yuan, with an annual capacity of 6,000 tons.
5
%
+
Proportion of R&D Investment turnover
10
%
Proportion of R&D Personnel companies
20
People
+
Research and development elite team led by doctoral supervisor
